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The DFP 8140 / DFP 8160 eliminates the need to use abrasives, chemicals or water to relieve the internal stress of the wafer. The DFP8140/8160 utilizes a dry polishing technique to eliminate the cracking layer produced by the grinding process. This technique not only reduces the damage and warpage of the wafer, but also enhances the strength of the crystal grains. The DFP8140/8160 can be combined with DISCO's grinder DFG8540/8560 to create an ultra-thin wafer solution that is wired, polished, dry polished, and secure and stable. This connection system can also be switched to stand-alone use. Even today's ultra-thin wafers

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Welding Wires

Welding wires are consumable electrodes used in the process of welding. They are made of various materials, such as carbon steel, stainless steel, aluminum, and flux-cored wire. Welding wires are designed to melt and join two or more metal pieces together when an electric current passes through them. They come in different diameters and compositions to suit different welding applications. Welding wires can be used with different types of welding processes, including MIG (Metal Inert Gas) welding, TIG (Tungsten Inert Gas) welding, and flux-cored arc welding

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